Prof. Duvan Henao, Pontificia Universidad Católica de Chile
Inviter:
Title:
Debonding of a gel from a rigid substrate
Time & Venue:
2019.11.26 10:00-11:00 Z311
Abstract:
A variational model for the delamination of polymer gel thin films from rigid substrates is presented. A formal asymptotic analysis of a simplified 2D version of the underlying governing equations show that, as the film grows thinner, the absorption of the moisture of its surroundings tends to produce a homogeneous vertical stretch in the part of the film that remains bonded to the substrate and a state of free swelling in the debonded part. A transition layer, with a width comparable to the film thickness, is developed in order to connect the two swelling modes. This work is joint with Carme Calderer (U. Minnesota), Carlos Garavito-Garzon (U. Minnesota), Suping Lyu (Medtronic, Inc.), and Lorenzo Tapia (PUC - Chile).
Appendix：
Copyright@2008, All Rights Reserved, Academy of Mathematics and Systems Science, CAS
Tel: 86-10-82541777 Fax: 86-10-82541972 E-mail: contact@amss.ac.cn
